Engineering – Our Building Blocks Architecture

FEI-Elcom Tech Inc. has a team of highly experienced engineers from multiple disciplines including MW and RF hardware design, digital design, embedded software, PCB design, ME design, schematic layout and systems software including GUI. Our combined design experience exceeds one hundred man years. Our engineers’ primary focus is bringing design to reality. Their talents are very well versed in combining MIC, MMIC, Hybrid Thin and Thick Film technologies all packaged in a single unit. With the aid of the latest CAD tools, simulation software, test equipment and most importantly, engineering initiative, Elcom has accomplished numerous engineering projects beyond the reach of most of our competitors. Our ability to meet or exceed the most challenging customer requirements is the reason why we are the “go to” company when defense and communication companies require exceptional designs for their most demanding requirements.

The performance of any RF chain or RF subsystem is dependent on multiple design considerations of the many building blocks that are joined together at the module and system level. When customers require maximum RF performance in their application, Elcom Technologies is their partner of choice. Our engineering team reflects a critical mass of technical core competencies unmatched in the industry. They include:

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  • PLL Algorithms and Topologies
  • High Frequency Filter Design
  • Low Phase Noise Oscillators
  • Fast Switching Synthesizers
  • RF Digital Signal Processing
  • Compressed Form Factors
  • Reduced Footprints
  • Low Power Consumption
  • FPGA Design and Embedded Software
  • System level Software and GUI


With Elcom’s approach of “built-in quality”, each individual on the assembly line has undergone an exceptional level of training on the most up-to-date manufacturing techniques, including ESD protection. In support of these core competencies, Elcom has invested in the infrastructure necessary to test, debug and produce solutions for our customers. This includes:

  • Agilent ADS and Genesys RF EDA
  • OrCAD PCB Design
  • Pro Engineer 3D CAD

  • AutoCAD
  • LPFK ProtoLaser 100 Laser System
  • HALT HASS Test Chamber

To facilitate tuning and testing, Elcom has over twenty microwave test stations. Each station is equipped with Spectrum Analyzer 9 KHz to 26 GHz signal source, Scalar Analyzer, scope, temperature plates (hot and cold) and microwave power meter. Test stations are computer controlled with application specific software developed to make typical measurements. The MIC assembly line is equipped with several gold and aluminum wire bonding machines. Focused on quality, Elcom produces highly sophisticated microwave components and subsystems for major programs, some having production runs as long as ten years. Our highly equipped manufacturing area includes the following:

  • MMIC Dry Storage
  • RF & MW Module Assembly
  • LabView ATE
  • Testing Capability up to 40 GHZ
  • RF Cable Assembly
  • Hermetically Sealed Packaging
  • Wire Bond Testing
  • 100% Burn In
  • MICRON Geometries (GaAs)
  • Chip: Wire Hybrids
  • Thin Film Circuits


Elcom’s 32,000-square-foot facility is located in Rockleigh, New Jersey. The facility houses all design, manufacturing and quality assurance activities. At Elcom, we believe in order to be a reliable and innovative vendor one has to be constantly evolving with today’s technology and standards. One example is the installation of an ESD protected floor throughout the factory, helping to remind all employees the need for ESD discipline. In addition, we have multiple in-house CAD stations, the latest microwave test equipment, ATE, Hybrid Technology, a dedicated Environmental Lab for E.S.S. (Environmental Stress Screening) and a dedicated HALT HASS chamber.